Protection of Electronic Components

Aging Protection through Innovative Atmospheric Pressure Plasma Coatings

Electronic components and assemblies are not only exposed to mechanical stresses during operation but also to harmful environmental influences such as humidity, temperature fluctuations, and particularly corrosive media. These factors can significantly impair the reliability and lifespan of electronics, often leading to costly repairs or failures. Here, Fraunhofer IFAM offers an innovative solution: ultra-thin atmospheric pressure (AP) plasma protective coatings. These coatings provide reliable protection against aging and environmental damage, improve performance, and simultaneously contribute to more sustainable manufacturing.

 

Ultra-Thin Plasma Coatings

Compared to conventional protective lacquers and potting compounds, the plasma polymer coatings developed at Fraunhofer IFAM feature a layer thickness of only a few hundred nanometers. This improves heat dissipation and enables higher packing densities of electronic components. The coatings are applied solvent-free and precisely at atmospheric pressure, contributing to a reduction in the Global Warming Potential (GWP).

 

Advantages of AP Plasma Technology

  • Environmental Friendliness: Solvent-free, dry process without VOC emissions.
  • Efficiency: No drying ovens required, resource-efficient coatings.
  • Sustainability: Reduced GWP and optimized resource utilization.
  • Technical Benefits: Improved component heat dissipation through ultra-thin layers.
  • Process Integration: Seamless automation and inline process monitoring.
  • Electrical Insulation: Use of insulating materials for the coating improves electrical properties, often enabling a reduction in insulation layer thickness.

 

Application Areas

AP plasma coatings are ideal replacements for conventional protective lacquers and potting compounds and are used in applications such as:

  • Coating of sensors (including optical sensors).
  • Localized protection of conductor tracks and contacts.
  • Protective layers on electronic boards.
  • Coating underneath assemblies on populated printed circuit boards.

Thanks to the versatility and sustainability of this technology, production processes can be simplified while simultaneously reducing costs.

 

Sustainable. Efficient. Future-Proof.

Rely on state-of-the-art AP plasma technology to protect your electronics from aging influences – environmentally friendly, economical, and future-oriented.